92-507059-XXX REV:M-07 | Embedded Cpu Boards
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  • 92-507059-XXX REV:M-07 | Embedded Cpu Boards
  • 92-507059-XXX REV:M-07 | Embedded Cpu Boards
  • 92-507059-XXX REV:M-07 | Embedded Cpu Boards
  • 92-507059-XXX REV:M-07 | Embedded Cpu Boards

92-507059-XXX REV:M-07

Trenton BXT7059

Trenton BXT7059 92-507059-XXX REV:M-07 Full Size System Host Board

The Trenton BXT7059 92-507059-XXX REV:M-07 is a combo-class PICMG 1.3 Full Size System Host Board designed for high-performance industrial and embedded computing applications. The BXT7059 supports Intel Xeon E5-2400 v2 Series and Intel Xeon E5-2400 Series processors, formerly codenamed Ivy Bridge-EN and Sandy Bridge-EN. These processor families deliver strong computing performance, PCI Express 3.0 I/O capability, and integrated three-channel DDR3 memory control for demanding system architectures.

Key Features

  • Full Size PICMG 1.3 System Host Board
  • Part number family: 92-507059-XXX
  • Model: BXT7059
  • Revision: M-07
  • Supports Intel Xeon E5-2400 v2 Series processors
  • Supports Intel Xeon E5-2400 Series processors
  • Processor architecture based on Ivy Bridge-EN and Sandy Bridge-EN
  • Designed for industrial, embedded, defense, and high-expansion computing systems

Processor and Memory Support

  • Processor Support: Intel Xeon E5-2400 v2 Series and Intel Xeon E5-2400 Series
  • Socket / Platform: Dual-processor combo-class PICMG architecture
  • PCIe Support: PCI Express 3.0 I/O support
  • Memory Controller: Three-channel DDR3 integrated memory controller per processor
  • Memory Speed: DDR3-1600 supported on most processor versions
  • Memory Slots: 6 x DDR3-1600 Mini-DIMM sockets on the BXT7059
  • Memory Capacity: 24GB with 4GB Mini-DIMMs, 48GB with 8GB Mini-DIMMs
  • Future Capacity Reference: Up to 96GB practical capacity with 16GB DDR3-1600 Mini-DIMMs if supported

PCI Express and Expansion Architecture

  • Each processor supports 24 PCI Express 3.0 lanes
  • CPU0 provides sixteen PCIe 3.0 lanes plus four PCIe 2.0 lanes from the Intel C604 PCH for PICMG 1.3 edge connector A & B backplane interfaces
  • CPU0 also provides an additional x4 PCIe 3.0 link for optional IOB33 I/O expansion module support
  • CPU1 provides a x16 PCIe 3.0 interface to the PEX10 expansion module
  • Supports enhanced bandwidth in systems using compatible backplanes such as the Trenton BPC7041
  • Intel Quick Path Interface (QPI) provides CPU-to-CPU communication for resource sharing

Video and I/O Features

  • Graphics: GPU driven by an internal x1 PCIe link
  • Maximum Resolution: Up to 1920 x 1200 (WUXGA) with 64k color depth
  • Ethernet: 3 x Gigabit Ethernet interfaces
  • 2 Gigabit Ethernet ports on the I/O plate
  • 1 additional Gigabit Ethernet interface available through a PICMG 1.3 compliant backplane or P22 alternate backplane cable connection
  • Storage: 2 x SATA/600 ports supporting independent drives or RAID arrays
  • Storage: 4 x SAS / SATA/300 ports supporting independent drives or RAID arrays
  • USB: 8 x USB 2.0 interfaces
  • 4 USB 2.0 interfaces routed to edge connector C for backplane use
  • Additional Storage I/O: 1 x SATA/300 interface routed to edge connector C for backplane integration

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