BXTS7059

Trenton BXTS7059 Single Processor System Host Board

Xeon® E5-2400 v2 Series or the Intel® Xeon® E5-2400-series processors.  The CPUs featured on the board were 

formally codenamed “Ivy Bridge-EN” and “Sandy Bridge-EN” respectively.  The Ivy Bridge-EN processors are 

built using the 22nm Intel Micro-Architecture while the Sandy-Bridge-EN processors were built using the 32nm 

Intel Micro-Architecture.  The 22nm micro-architecture enabled several performance improvements including 

additional executing cores, better TDP ratingss and improved power utilization.  Both processor families feature 

PCI Express 3.0 I/O support and a three-channel DDR3 integrated memory controller.  The three-channel 

memory controller in most of the processors support DDR3-1600 memory interface speeds.  The three memory 

channels per processor results in six direct access memory interfaces on the BXT7059 board version and the 

interfaces connect to six DDR3-1600 Mini-DIMM sockets.  With 4GB DDR3 Mini-DIMMs the total system 

memory capacity for a BXT7059 is 24GB and doubles to 48GB when using 8GB DDR3 Mini-DIMMs.  If 

16GB DDR3-1600 Mini-DIMMs become a reality, the maximum practical system memory capacity supported 

on the BXT7059 will grow to 96GB; with 192GB being the maximum theoretical capacity.  The system 

memory capacities are cut in half for the single processor BXTS7059 board version.    

Each processor option supports twenty-four (24) PCI Express 3.0 links.  In the BXT7059 board design, sixteen 

of these links from CPU0 plus four additional PCIe 2.0 links from the board’s Intel® C604 Platform Controller 

Hub (PCH) comprise the PICMG 1.3 edge connector A & B backplane interfaces.  CPU0 also provides an 

additional x4 PCIe PCIe 3.0 link for use on a backplane equipped with an I/O expansion slot that supports an 

optional IOB33 I/O expansion module attached to either a BXT7059 or BTXS7059 SHB.  CPU1 on the 

BXT7059 dual-processor board configuration delivers a x16 PCIe 3.0 interface to the PEX10 expansion module 

and these PEX10 extra links provide added bandwidth to systems equipped with a backplane such as the 

Trenton BPC7041.  The Intel® Quick Path Interface (Intel® QPI); with a maximum transfer speed for some 

processor versions of up to 8GT/s, provides the communication path between CPUs on the BXT7059 to enable 

resource sharing.  All of the PCI Express interface links needed for a PICMG 1.3 compliant backplane are 

provided by the links out of CPU0 and the additional PCIe link out of the Intel® C604 Platform Controller Hub 

(PCH).  

Video and I/O features on the BXT boards include: 

• A Graphics Processing Unit (GPU) driven with an internal x1 PCIe link and capable of 

supporting pixel resolutions up to 1920 x 1200 (WUXGA) with a 64k color depth 

• Three Gigabit Ethernet interfaces with two on the I/O plate and one available for use on a 

PICMG 1.3 compliant backplane or via the P22 alternate backplane cable connection. 

• Two SATA/600 ports that can support independent drives or RAID drive arrays 

• Four SAS / SATA/300 ports that can support independent drives or RAID drive arrays 

• Eight USB 2.0 interfaces, with four routed to edge connector C for use on a backplane 

• One SATA/300 interface routed to edge connector C for use on a backplane