BXTS2.5ERV20

The BXT7059 and BXTS7059 are combo-class, PICMG
Xeon®E5-2400 v2 Series or the Intel® Xeon® E5-2400-series processors. The CPUs featured on the board were formally codenamed “Ivy Bridge-EN” and “Sandy Bridge-EN” respectively. The Ivy Bridge-EN processors are built using the 22nm Intel Micro-Architecture while the Sandy-Bridge-EN processors were built using the 32nm Intel Micro-Architecture. The 22nm micro-architecture enabled several performance improvements including additional executing cores, better TDP ratingss and improved power utilization. Both processor families feature PCI Express 3.0 I/O support and a three-channel DDR3 integrated memory controller. The three-channel memory controller in most of the processors support DDR3-1600 memory interface speeds. The three memory channels per processor results in six direct access memory interfaces on the BXT7059 board version and the interfaces connect to six DDR3-1600 Mini-DIMM sockets. With 4GB DDR3 Mini-DIMMs the total system memory capacity for a BXT7059 is 24GB and doubles to 48GB when using 8GB DDR3 Mini-DIMMs. If 16GB DDR3-1600 Mini-DIMMs become a reality, the maximum practical system memory capacity supported on the BXT7059 will grow to 96GB; with 192GB being the maximum theoretical capacity. The system memory capacities are cut in half for the single processor BXTS7059 board version.

Each processor option supports twenty-four (24) PCI Express 3.0 links. In the BXT7059 board design, sixteen of these links from CPU0 plus four additional PCIe 2.0 links from the board’s Intel® C604 Platform Controller Hub (PCH) comprise the PICMG 1.3 edge connector A & B backplane interfaces. CPU0 also provides an additional x4 PCIe PCIe 3.0 link for use on a backplane equipped with an I/O expansion slot that supports an optional IOB33 I/O expansion module attached to either a BXT7059 or BTXS7059 SHB. CPU1 on the BXT7059 dual-processor board configuration delivers a x16 PCIe 3.0 interface to the PEX10 expansion module and these PEX10 extra links provide added bandwidth to systems equipped with a backplane such as the Trenton BPC7041. The Intel® Quick Path Interface (Intel® QPI); with a maximum transfer speed for some processor versions of up to 8GT/s, provides the communication path between CPUs on the BXT7059 to enable resource sharing. All of the PCI Express interface links needed for a PICMG 1.3 compliant backplane are provided by the links out of CPU0 and the additional PCIe link out of the Intel® C604 Platform Controller Hub (PCH).

Video and I/O features on the BXT boards include:

• A Graphics Processing Unit (GPU) driven with an internal x1 PCIe link and capable of

  supporting pixel resolutions up to 1920 x 1200 (WUXGA) with a 64k color depth

• Three Gigabit Ethernet interfaces with two on the I/O plate and one available for use on a

  PICMG 1.3 compliant backplane or via the P22 alternate backplane cable connection.

• Two SATA/600 ports that can support independent drives or RAID drive arrays

• Four SAS / SATA/300 ports that can support independent drives or RAID drive arrays

• Eight USB 2.0 interfaces, with four routed to edge connector C for use on a backplane

• One SATA/300 interface routed to edge connector C for use on a backplane